EHWA PDW - Sapphire Wafer Preparation Diamond Wire

PublishTime：2025-03-16

EHWA PDW is a widely accepted diamond wire for slicing and cropping processes in the preparation of 2”, 4”, 6”, and now expanding to 8” sapphire wafers. It offers superior thermal stability, longer lifetime, and faster cutting times compared to resin-coated diamond wires, resulting in high throughput. The document provides specifications for various PDW models, including order codes, core material, diamond size, kerf loss, and concentration, along with availability details.

Brand of Product：	EHWA
Part#：	50-D-9 、 60-D-10 、 70-D10 、 80-D12 、 90-D12 、 120-D15 、 160-D35 、 180-D35 、 180-D45 、 200-D35 、 250-D35 、 250-D50 、 300-D50 More Part#
Product Category：	Diamond Wire for Sapphire Wafer Preparation More
Application：	[ Slicing and cropping process for sapphire wafer preparation ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：
Version Number：
Data Encoding：
Data Size：	609 KB

Data section preview(2pages)

- The full preview is over,the data is 2 pages -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits