SEMICOSIL ® 961 TC THERMALLY CONDUCTIVE GAP FILLER WITH 2.3 W/mK
cost effectively to handle and renders save functionality and durability.
●Product Description
■Two component addition curing silicone, which cures at room temperature or faster at elevated temperature to a soft and tacky gap filling material with a thermal conductivity of 2.3 W/mK.
●Features of SEMICOSIL ® 961 TC
■High dispensing speed for short cycle time
■Low volatile content
■UL 94 V-0 rating (tested at WACKER)
■Constant properties between-50 °C and +180 °C
■Low abrasiveness
[ Automotive electronics ][ Battery assembly for Electric Vehicles ][ EV ][ Hybrid Electric Vehicles ][ HEV ][ Power electronics ][ Consumer electronics ][ electronics ][ electrical ][ battery ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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04.17 |
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7399e |
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1.8 MB |
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