2412181608 New Process & Material Qualification for EFM32LG & EFM8SB1 WLCSP Package
■ Description of Change
▼Silicon Labs is pleased to announce the successful qualification of a new bumping process that includes applying plating Re-distribution layer (RDL) and Under-bump metallurgy for EFM32LG & EFM8SB1 WLCSP package.
▼This bumping process change was initiated due to supplier BASF End of Life (EOL) announcement of copper etchant surfactant R104-B with production stop on Mar 31, 2024. In addition, certain bumping machines for 8inch wafers have already been phased out by the vendor and factory machinery service is limited (FOI Descum, Msetek PBO coating)
▼As of the effective date of the PCN, Silicon Labs will fulfill orders with either bumping process material until old inventory depletes.
■ Reason for Change
▼Supply continuity due to current supplier (BASF) EOL of copper etchant surfactant R-104B.
■ Impact on Form, Fit, Function, Quality, Reliability
▼No change to Form, Fit, Function, Quality and Reliability.
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EFM32LG 、 EFM8SB1 、 EFM8SB10F8G-A-CSP16 、 EFM8SB10F8G-A-CSP16R 、 EFM32LG360F256G-F-CSP81 、 EFM32LG360F256G-F-CSP81/R 、 EFM32LG360F256G-F-CSP81R |
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PCN/EOL |
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Please see the document for details |
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WLCSP |
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English Chinese Chinese and English Japanese |
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Dec 18, 2024 |
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2412181608;2024-12-18-1608 |
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1001 KB |
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Mar 24, 2025 |
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Assembly |
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