GAP9-based TWS/Headphones Hardware Architectures with Implementation Guidelines
●This document presents hardware architecture options for TWS (True Wireless Stereo) earbuds and Bluetooth-connected Headphones – with single or dual GAP9. These are essentially examples, which can be departed from according to specific constraints or preferences.
●Also provided are implementation guidelines in the form of notes pertaining to specific aspects of these architecture.
●The intent is to help system architects and PCB designers integrate GAP9 into their target ‘bearable product in an efficient manner, quickly getting to a viable schematic.
●Obviously, architecture choices should also be made in the light of implication on software complexity.
●When going to the implementation phase, it is important to read the present document in conjunction with the two Applications Notes referenced at the end of this document : ‘GAP9 Hardware Integration Guide’ and ‘Audio Clicks for GAP9 – H/W Options and System Implication.
●Note : Besides the type of product family (TWS or Headphones) and allocated hardware resources and their partitioning (single or dual GAP9, symmetrical architecture or not), an important decision that impacts required interfaces between BT-SOC and GAP9 is whether the audio codec (SBC/AAC/LC3...) is left to the BT-SOC or is running on GAP9. There is a significant energy benefit in running compute-intensive, state-of-the-art audio codecs on GAP9; it may also open up support of BT-SOC models with no readily available I2S/TDM interface and it enables connecting more microphones to GAP9.
●In the following, we introduce baseline scenarios where the audio codecs are running on the BT-SOC., plus variants where the audio codec runs on GAP9.
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