GAP9 HARDWARE INTEGRATION GUIDE for WLCSP package variant
●This Application Note is intended to help hardware designers integrate GreenWaves GAP9 ultra-low power Application Processor chip for edge AI into their board design.
●It is relevant for the initial WLCSP-100 (Wafer Level Chip Scale Package) version of GAP9. GAP9 may also come in the form of bare die (KGD, Known Good Die) or in a different package such as BGA with more I/Os, appropriate instructions for those variants will be provided in due time.
●Note: Marks noted « [Ref.X] » in this text point to references provided at the end of the document.
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[ edge AI ] |
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User's Guide |
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Please see the document for details |
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WLCSP;BGA |
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English Chinese Chinese and English Japanese |
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16. May, 2024 |
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Rel.1.6 |
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3.2 MB |
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