X200SC EMBER Chip Scale Packaged Quad Transceiver Product Brief

2024-11-22
●The X200SC EMBER is a Chip-Scale Package (CSP) surface-mount instantiation of a 4-channel transceiver for parallel optical data communications from 1.25 Gbps up to 25/28 Gbps per channel. The X200SC EMBER integrates into a single reflow solderable package a microcontroller unit (MCU), transceiver IC, a GaAs Vertical Cavity Surface Emitting Laser (VCSEL) array, a GaAs PIN photodetector (PD) array and a glass lens array with a lens guide mechanism allowing registration of the RVCONTM parallel fiber termination. The X200SC EMBER electrical interface consists of BGA solder balls that can be reflow soldered onto a circuit board. The X200SC EMBER is designed for hi-reliability systems that require operation in harsh environments, including extended temperature ranges, shock and vibration, temperature cycles and high humidity. It includes advanced built-in-test functionality for continuous monitoring of operating conditions, both internal IC status and external parameters, such as fiber optic link-loss and signal quality.
●FEATURES:
■Operating data rate: 1.25 Gbps to 25/28
■Gbps per channel
▲Integrated reference-free CDR for 25/28 Gbps operation
▲Multi rate functionality available on certain transceivers – see product- specific
■SMT reflow solderable package
■Removeable connector/fiber termination
■850 nm VCSEL transmitter
■Package size: 7.7 x 10 mm
■Temperature range: -40 to +95°C
▲See product-specific datasheet for defined operating temperature range
■Module management, controls, and diagnostics available on I2C & UART
▲DDMI interface based upon SFF-8636 standard
■High Rx dynamic range with AGC (Automatic Gain Control)
■Individual channel power-down

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X200SC EMBER

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Chip Scale Packaged Quad TransceiverQuad Transceivertransceiver

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parallel optical data communications ]

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Datasheet

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Please see the document for details

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English Chinese Chinese and English Japanese

2020/9/2

DOC12275.01

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