LD Series Low Power Datasheet
■Low Power Infrared VCSEL.
■Silicone resin.
■GaAs technology Chip Material.
■Compatible with automatic placement equipment.
■Compatible with reflow solder process.
■Suitable for all SMT assembly methods.
■Doesn’t contain restriction Substance, comply ROHS standard.
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[ ToF ][ 3D sensing ][ Optical communication ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/3/16 |
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Rev:1 |
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472 KB |
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