QSMP135 QS Family QFN Style Solder-Down Computer-on-Modules

2024-10-12
■Solder-down version
■27mm square
■2.3mm total height
■QFN type lead style
●1mm pitch
●100 pads
●Thermal pad
■Visual solder joint inspection possible after soldering
■Single-sided assembly
■High speed design compliant
■3.3V power supply
■Key Features
●Processor
▲STM32MP135C
▲Arm® Cortex®-A7 650MHz
●RAM: 256MB DDR3L
●ROM: 4GB eMMC
●Grade: Industrial
●Temperature: -25℃ to 85℃
●Display support
▲Display Interface: 24-bit RGB
●Connectivity
▲Gb Ethernet, USB2.0, eMMC/SD
▲UART, I²C, SPI, PWM, SAI, CAN
▲Two additional pin groups for RS485

Ka-Ro Electronics

QSMP135QS FamilyQSQSMP-1351QSMP-1530CQSMP-1570QSMP/135C/256S/4GF/E85QSMP/157C/256S/4GF/E85QSMP/157C/512S/4GF/E85

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Part#

Solder-Down Computer-on-Modules

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Datasheet

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QFN

English Chinese Chinese and English Japanese

2024/01/08

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