IC and Package Co-Simulation Faraday Dynamics EDA Solutions
■Traditionally, chip design and package design are developed separately by different engineering teams. It imposes considerable iteration time and high communication costs. ® Faraday Dynamics has developed a unique chip and package co-simulation flow. It provides easy-to-use 3D modeling capability and a specially designed simulation solver for co-simulation, which can reduce the number of iterations; improve the design success rate; and enable chip engineers to assess the package performance at any time during the design process.This reference case demonstrates the co-simulation task of a 5G bandpass filter design using a gallium arsenide process that operates at a frequency range from 3.3GHz to 4.2GHz, a center frequency of 3.8GHz.
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024/3/5 |
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692 KB |
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