CC3-465 LIGHT WEIGHT EPOXY POTTING COMPOUND
▲CC3-465 resin was developed for the semiconductor industry as a light weight, low dielectric constant epoxy potting compound. Its low viscosity and good wetting properties enable densely packaged circuitry to be totally encapsulated, void free without the aid of a vacuum in most cases. The hollow glass microspheres increase its structural strength and electrical insulation while reducing shrinkage and thermal conductivity.
▲CC3-465 is easy to use and is readily adaptable to automatic machine dispensing. It cures at room temperature or with heat and meets most military and UL flame retardant requirements.
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LIGHT WEIGHT EPOXY POTTING COMPOUND 、 resin 、 light weight, low dielectric constant epoxy potting compound |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2019/6/1 |
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60 KB |
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