A2001W0-1XX2XXX Pitch 2. 0mm 180°PH单排立贴 Wafer
■MATERIAL SPECIFICATION:
▲HOUSING: LCP,UL94V-0
▲CONTACTS: BRASS
▲SOLDERING LUG: BRASS
■PLATING SPECIFICATION:
▲CONTACTS: TIN/GOLD FLASH PLATED.
▲SOLDERING LUG: TIN PLATED OVER ALL.
■ELECTRICAL PERFORMANCE:
▲CURRENT RATING: 2A
▲CONTACT RESISTANCE: 20 mΩ MAX
▲INSULATION RESISTANCE: 1000ΜΩ Min
▲DIELECTRIC WITHSTANDING : 800V
■ENVIRONMENTAL PERFORMANCE:
▲OPERATING TEMPERATURE: -25℃~+85℃.
■PACKAGE SPEC: TRAY
■P/N: A2001W0-1XX2XXX
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2024.6.17 |
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REV: A2 |
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947 KB |
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