MC225-T2250-10 MicroSD 7.1 H2.25 push-push

2024-06-29
●Note: ■Material: ▲Plastic: LCP, S470, Black, UL94V-0 ▲Contact: C5210 ▲Shell: SUS304 ■Plating: ▲Contact: ◆Contact Area: Au 3μ" min. Plating Over Ni 50μ" min. ◆Soldertail: Matted TIN 80μ" min. Over Ni 50μ" min. ▲Shell: ◆Solderability Ni 50μ" min. Over All ■Contat An Til Coplanarity To Be 0.01.mm max.

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MC225-T2250-10

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2024.05.07

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D-MC225-T2250-10

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