DuraFlash™ BGAE240 | eMMC | 153-ball/100-ball
●SMART’s BGAE240 eMMC solution is available in the standard JEDEC 0.5mm pitch, 153-ball package, as well as an eMMC interposer module which has a footprint and pin-out compatible with the JEDEC Standard 1.0mm pitch, 100-ball package. The 100-ball package offers a solution with large ball pitch and ball diameter which enables lower cost PCB designs, simplifies PCB routing with wider metal traces, resulting in better thermal dissipation.
●Features & Benefits
■Compliant to JEDEC v5.0 Standard
■Capacities from 4GB to 32GB
■Pre-Configurable to pSLC Enhanced Storage Media Mode
■Wide Temp (-40℃ to +105℃)
■VCC = 3.3V and VCCQ = 3.3V or 1.8V
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BGAE240 、 KTMBGP1CWW01 、 KTMAGP1CWW01 、 KTM8GP1CWW01 、 SPQBGP1CWW01 、 SPQAGP1CWW01 、 SPQ8GP1CWW01 、 SPMBGP1CWW11 、 SPMAGP1CWW11 、 SPM8GP1CWW11 、 SPQBGP1CWW11 、 SPQAGP1CWW11 、 SPQ8GP1CWW11 |
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[ Factory Automation ][ Medical Devices ][ Networking Appliances ][ POS Terminals ][ RFID Scanners ][ Single-Board Computers ][ VoIP ] |
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Datasheet |
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Please see the document for details |
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BGA |
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English Chinese Chinese and English Japanese |
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04.05.24 |
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Rev.3 |
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1021 KB |
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