SS32D1F~SS310D1F

2024-06-19
●FEATURES
■ Low profile package
■ Ideal for automated placement
■ Ultrafast reverse recovery time
■ Low power losses, high efficiency
■ Low forward voltage drop
■ High surge capability
■ High temperature soldering: 260℃/10 seconds at terminals
■ Component in accordance to RoHS 2002/95/1 and WEEE 2002/96/EC

SUMSEMI

SS32D1FSS310D1F

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Datasheet

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Please see the document for details

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SOD-123

English Chinese Chinese and English Japanese

2020/3/11

V 1.0

653 KB

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