Chemraz® 663 Provides enhanced plasma resistance in low-temperature Etch and Deposition environments (down to -40°C) DATASHEET
●Plasma-Resistant FFKM Down to -40°C
■Chemraz® 663, a perfluoroelastomer (FFKM), is engineered to withstand low-temperature Etch and Deposition applications where plasma resistance and the ability to maintain sealing force in a vacuum are critical, such as electrostatic chuck assemblies.
|
[ Electrostatic chuck ][ ESC ][ electrostatic chuck assemblies ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
10/18 |
|
|
|
|
|
DS-US-SC-174 |
|
|
692 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
