TP-H350LD series Thermal Gap Filler DATA SHEET

PublishTime：2024-06-12

●The product’s density is 2.3~2.5g/cc,which is 30% lower than the conventional thermal pad.It also has high strength,low permanent deformation and good flame retardancy.It is the best choice for lightweight PACK
●FEATURES:
■High thermal conductivity
■Low density
■High insulation
■High fire resistance

Brand of Product：	HFC
Part#：	TP-H350LD 、 TP-H350LD series More Part#
Product Category：	Thermal Gap Filler More
Application：	[ chip ][ heat-dissipation modules ][ Optoelectronic Industry ][ Netcom products ][ New energy battery ][ vehicles industry ][ Wearable equipments ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2024-04-02
Version Number：
Data Encoding：
Data Size：	683 KB

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