SD-TF03-1108A2-S304 MICRO SD 卡 短體不帶偵測PIN CONNECTOR
■Electrical:
▲Contact Resistance: 50 mΩ Max.
▲Insulation Resistance: 1000 MΩ Min.
▲Dielectric Withstanding Voltage: 500V RMS.
▲Life Cycles: 1500 cycles Min
▲Mate Force: 4.5kgf Max
▲Unmate Force: 0.5kgf Min
■Environmental:
▲Operating Temperature: -25℃~+85℃.
■Material:
▲Housing: LCP,Black
▲Contact: Copper Alloy
▲Shell: SPCC
■Finish:
▲Contact:
◆Plated Gold in Mating Area;
◆Tin Plated on Solder Balls;
◆Nickel under plated overall
▲Shell: Nickel under Plated surface layer
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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07/13/20 |
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VER:R1 |
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1.5 MB |
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