XB-USB31-TYPEC-33X39 Type-C 3.1

2024-05-30
●Material
■Housing Material: High temperature thermoplastic
■Contact Terminal: High Grade Copper Alloy
■Metallic Shell: Stainless Steel
■Cover Shell: Iron
■Inner Ground Cover Shell: Stainless Steel
■Mid Plate: Stainless Steel
●Plating
●Data Contact
■Underplating: 50μ" Min. Nickel
■Contact Plating: 1μ" Gold
■Solder Area: 80μ" Matte Tin
●Shell
■Metallic Shell: 50μ" Min. Nickel
●Cover Shell
■Metallic Shell: 80μ" Min. Nickel
●Inner Ground Cover Shell
■Metallic Shell: 50μ" Min. Nickel
●Electrical
■Voltage Rating: 20V DC
■Current Rating: Vbus pins collectively 5.00A, GND pins collectively 6.25A,B5 pin 1.25A, Other pins 0.25A per pin
■Contact Resistance: 40mΩ Max.
■Insulation resistance: 100 MΩ min.
■Dielectric withstanding voltage: 100V AC/Minute
●Mechanical
■Durability: 10,000 cycles
■Mating Force: 5 to 20N
■Unmating Force: 8 to 20N(post test)

XB

XB-USB31-TYPEC-33X39USB31-TYPEC-33X39-XFS

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Please see the document for details

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English Chinese Chinese and English Japanese

2024/05/08

REVISION:A0

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