XB-102313872 1.35H NANO SIM掀盖内焊
■MATERIAL:
▲HOUSING: LCP UL94V-0,BLACK
▲CONTANCT:
◆C5191,30μ" Ni UNDERPLATED OVAERALL
◆G/F PALTED ON CONTACT AREA& SOLDER AREA
▲SHELL:
◆SUS304,30μ" Ni UNDEROLATED OVERALL
◆G/F PALTED ON SOLDER AREA
■ELECTRICAL CHARACTERISTICS:
▲CONTACT RESISTANCE: 50mΩ MAX.
▲INSULATION RESISTANCE: 1000ΜΩ MIN.
▲DIELECTRIC WITHSTANDING VOLTAGE: 500V AC FOR 1 MINUTE
■OPERATION TEMPERATURE:-40℃~+85℃
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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07/12'16 |
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REV. A0 |
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572 KB |
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