XB-102322702 Micro SD BOT H1.80MM P/P

PublishTime：2024-05-25

●Note:
■Material: See Table
■Finishes: See Table
▲Contact: Nickel Underplated Gold Flash Plating on Contact Area,Gold Flash on Solder Tail
▲Switch & Detect: Nickel Underplated Gold Flash Plating on Contact Area
▲Shell: Gold Flash Over Nickel Underplated on Solder Pad
■Coplanarity of Soldertails : 0.10MAX.
▲Misalignment of Solder Tail From "Z” Upper Direction 0.05 MAX.,Lower Direction 0.1 MAX.
■Mechanical Specification:
▲Repeated 10000 Times Mating and Unmating Cycles and Still Meet Electrical Characteristics
■Electrical Specification:
▲Rated Current(Per Contact): 0.5Amps MAX and Temperature Rise Should be 30℃ MAX.
▲Insulation Resistance(LR):1000 Megohms MlN.
▲Dielectric With Standing Voltage: 500VAC
▲Contact Resistance:100 Milliohms MAX

Brand of Product：	XB
Part#：	XB-SD-MICRO-102322702 、 XB-102322702 More Part#
Product Category：	More
Application：	More
Data Type：	Product Drawing More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	08/03/19
Version Number：	REV.X2
Data Encoding：
Data Size：	829 KB

Data section preview(2pages)

- The full preview is over. If you want to read the whole 3 page document,please Sign in/Register -

Download

+1 Like
Add to Favorites

Recommend

Technical Resources

More>

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Integrated Circuits