S2AB~S2MB
■For surface mounted applications
■Low profile package
■Built- in strain relief, ideal for automated placement
■Glass Passivated chip junction
■High temperature soldering guaranteed 250℃/10 second at terminals
●MECHANICAL DATA
■Case: JEDED DO-214AA molded plastic over glass passivated chip
■Terminals: Solder plated, Solderable per MIL-STD-750 , method 2026
■Polarity: Color band denotes cathode end
■Weight: 0.002 ounce, 0.064 gram
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Datasheet |
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Please see the document for details |
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DO-214AA |
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English Chinese Chinese and English Japanese |
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2022/7/1 |
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300 KB |
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