8.0SMDJ Series TVS Diodes Transient Voltage Suppression Diodes
2024-04-17
●Description
■Transient Voltage Suppressor (TVS) is a circuit protection component that either attenuates (reduces) or filters a transient voltage spike (overvoltage), TVS diodes provide critical protection by going into avalanche breakdown within no more than a few nanoseconds after a strike, clamping the transient voltage, and routing its current to the ground.
●Features
■8000 W peak pulse power capability with a 10/1000 μs Waveform, repetition rate (duty cycles): 0.01%
■Low incremental surge resistance
■Excellent clamping capability
■Low profile package with built-in strain relief
■Typical IR less than 5 μA when VBR min > 22 V
■For surface mounted applications to optimize board space
■Typical failure mode is short from over-specified voltage or current
■IEC 61000-4-2 ESD 30 kV (Air), 30 kV (Contact)
■EFT protection of data lines in accordance with IEC 61000-4-4
■Very fast response time
■Glass passivated chip junction
■High temperature to reflow soldering guaranteed: 260 ℃ / 40 sec
■VBR @ TJ= VBR@25 ℃ x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
■Plastic package is flammability rated V-0 per Underwriters Laboratories
■Meet MSL level1, per J-STD-020,
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
■Transient Voltage Suppressor (TVS) is a circuit protection component that either attenuates (reduces) or filters a transient voltage spike (overvoltage), TVS diodes provide critical protection by going into avalanche breakdown within no more than a few nanoseconds after a strike, clamping the transient voltage, and routing its current to the ground.
●Features
■8000 W peak pulse power capability with a 10/1000 μs Waveform, repetition rate (duty cycles): 0.01%
■Low incremental surge resistance
■Excellent clamping capability
■Low profile package with built-in strain relief
■Typical IR less than 5 μA when VBR min > 22 V
■For surface mounted applications to optimize board space
■Typical failure mode is short from over-specified voltage or current
■IEC 61000-4-2 ESD 30 kV (Air), 30 kV (Contact)
■EFT protection of data lines in accordance with IEC 61000-4-4
■Very fast response time
■Glass passivated chip junction
■High temperature to reflow soldering guaranteed: 260 ℃ / 40 sec
■VBR @ TJ= VBR@25 ℃ x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
■Plastic package is flammability rated V-0 per Underwriters Laboratories
■Meet MSL level1, per J-STD-020,
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 means 2nd level interconnect is Pb-free and the terminal finish material is tin(Sn) (IPC/JEDEC J-STD-609A.01)
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