AD Series™ High Frequency Laminates STRIPLINE AND MULTILAYER CIRCUITS Fabrication Notes
■The AD Series™ of copper clad laminates (AD250C™, AD255C™, AD300D™, and AD350A™) combines the superior thermal properties of a fluoropolymer resin system with selected ceramic fillers and fiberglass reinforcement to yield laminated materials with low loss, low thermal expansion characteristics, and low passive intermodulation (PIM). Stability of PTFE over wide frequency and temperature ranges makes AD Series materials ideal for a variety of microwave and RF applications in telecom infrastructure. The inclusion of micro-dispersed ceramic provides thermal stability to the laminate in the form of lower CTE values and greater phase stability across temperatures.
■These guidelines were developed to provide fabricators with basic information on processing double-sided and multi- layer boards using copper clad filled and reinforced PTFE composite materials. A Rogers’ technical service engineer or sales representative should be contacted for more detailed processing information.
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AD Series™ 、 AD250C™ 、 AD255C™ 、 AD300D™ 、 AD350A™ 、 AD Series 、 AD250C 、 AD255C 、 AD260 、 AD300C 、 AD320A 、 AD350A |
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Application note & Design Guide |
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Please see the document for details |
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