HFC H200-SF series Thermal Gap Filler DATA SHEET

PublishTime：2024-03-04

●Silicone Free Thermal Pad is a curing and molding material with of acrylic adhesive and thermal material. It has good insulating properties, excellent resistance to aging, high flexibility and good self-adhesive. Even after prolonged use it would not have oil leakage. Especially suitable for the silicone oil sensitive places, therefore they are widely used in high-end electronic industry such as high sensitivity detector and high-definition cameras.
■FEATURES:
●Without silicon components
●High thermal conductivity property
●Good flexibility, high strength and high elasticity

Brand of Product：	HFC
Part#：	H200-SF series 、 H200-SF More Part#
Product Category：	Thermal Gap Filler 、 Silicone Free Thermal Pad 、 curing and molding material More
Application：	[ high-end electronic industry ][ high sensitivity detector ][ high-definition cameras ][ Mobile electronic equipment ][ Microprocessors ][ chips ][ Automotive engine control unit ][ Laptop ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/4/23
Version Number：
Data Encoding：
Data Size：	360 KB

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