CSI061516535001 SIM CARD 6+2P H=3.5MM
■Material&Finish:
▲Insulation Material: LCP UL94-V0 Black
▲Contact and Swich: Phosphor Bronze C5210,
▲Contact area 3u” Au over min 50u” Ni;
▲Solder tail 50u” tin over min 50u” Ni;
▲Shell: Stainless Steel SUS304
■Electrical Characteristics
▲Current Rating: 1A
▲Contact Resistance: 50mΩ typical, 100mΩ Max
▲Insulation Resistance: 1000MΩ Min At 500V DC
■Mechanical Characteristics
▲Mechanical life: 10000 Mating Cycles Min
▲Contact Force: 0.20-0.60N
■Environmental Characteristics
▲Operating temperature: -40°C~+85°C
▲Operating humidity: 10%~95% RH
▲Storage temperature:-40°C~+85°C
▲Storage humidity: 10%~95%RH
▲Thermal shock: -40°C~+85°C, 5cycles
▲Damp Heat: 40°C, 90% RH, 500HR.
▲Salt-mist: 35°C, 5%, NaCl, 48H.
▲IR Reflow: 260°C 10 Sec Max
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2023/12/7 |
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REV A |
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128 KB |
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