HFCH700-Soft series Thermal Gap Filler DATA SHEET

PublishTime：2024-02-02

●HFC H700-soft thermal conductive silicon pad is a kind of thermal interface material with high thermal conductivity, low thermal resistance and single surface. The product has good stress response and ultra-low installation stress, which can avoid the damage of installation stress to the parts such as chip, PCB and so on. The product has natural viscosity and high compressibility, which can fill the gap well and realize heat transfer between heating parts and cooling parts. It is an excellent heat conducting filler and is widely used in electronic products.
●FEATURES:
■Being able to work under low pressure and excellent compression performance
■No rebound stress or low rebound stress
■Low thermal resistance
■Good interface contact
■Excellent insulation performance and high breakdown voltage
■Single adhesive

Brand of Product：	HFC
Part#：	HFCH700 series 、 HFCH700 More Part#
Product Category：	Thermal Gap Filler 、 soft thermal conductive silicon pad 、 thermal interface material More
Application：	[ chip ][ heat-dissipation modules ][ Optoelectronic Industry ][ Netcom products ][ Household appliances ][ Wearable equipments ][ electronic products ] More
Data Type：	Datasheet More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2022/8/2
Version Number：
Data Encoding：
Data Size：	738 KB

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