30KPA Series TVS Diodes
2024-01-30
●Description
■The 30KPA Series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
●Features
■30 kW peak pulse capability at 10/1000 μs waveform, repetition rate (duty cycles):0.01%
■Glass passivated chip junction in P600 Package
■Fast response time: typically less than 1.0 PS from 0 Volts to BV min
■Excellent clamping capability
■Typical failure mode is short from over-specified voltage or current
■Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■IEC 61000-4-2 ESD 30 kV (Air), 30 kV (Contact)
■ESD protection of data lines in accordance with IEC 61000-4-2
■EFT protection of data lines in accordance with IEC 61000-4-4
■Low incremental surge resistance
■Typical IR less than 2 μA when VBR min > 73 V
■High temperature to reflow soldering guaranteed: 260 ° C/40 sec / 0.375”, (9.5 mm) lead length, 5 lbs., (2.3 kg) tension
■VBR @ TJ= VBR@25 °C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
■UL Recognized compound meeting flammability rating V-0
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 indicates that 2nd level interconnect is Pbfree and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD-609A.01)
■The 30KPA Series is designed specifically to protect sensitive electronic equipment from voltage transients induced by lightning and other transient voltage events.
●Features
■30 kW peak pulse capability at 10/1000 μs waveform, repetition rate (duty cycles):0.01%
■Glass passivated chip junction in P600 Package
■Fast response time: typically less than 1.0 PS from 0 Volts to BV min
■Excellent clamping capability
■Typical failure mode is short from over-specified voltage or current
■Whisker test is conducted based on JEDEC JESD201A per its table 4a and 4c
■IEC 61000-4-2 ESD 30 kV (Air), 30 kV (Contact)
■ESD protection of data lines in accordance with IEC 61000-4-2
■EFT protection of data lines in accordance with IEC 61000-4-4
■Low incremental surge resistance
■Typical IR less than 2 μA when VBR min > 73 V
■High temperature to reflow soldering guaranteed: 260 ° C/40 sec / 0.375”, (9.5 mm) lead length, 5 lbs., (2.3 kg) tension
■VBR @ TJ= VBR@25 °C x (1+αT x (TJ - 25)) (αT:Temperature Coefficient, typical value is 0.1%)
■UL Recognized compound meeting flammability rating V-0
■Matte tin lead–free plated
■Halogen free and RoHS compliant
■Pb-free E3 indicates that 2nd level interconnect is Pbfree and the terminal finish material is tin(Sn) (IPC/ JEDEC J-STD-609A.01)
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