Microminiature Connectors Catalog
●Microminiature Interconnect Solutions
■Ultra lightweight, space-saving connectors and cable assemblies for unmatched performance & reliability in the harshest environments
▲ITT Cannon is your one-stop source for the design and manufacture of Microminiature solutions for the high performance connector market.
▲Offering one of the broadest selections of standard and custom Microminiature products available, ITT Cannon versatile portfolio includes a wide range of shell styles and configurations including rectangular, circular, quick disconnect, filter, hermetic, mixed signal packages and strip-style.
▲Each one features Cannon-engineered Micro Twist Pin Contact System for maximum performance, as well as unique mechanical engagement and locking mechanisms to ensure reliability in the harshest environments.
▲Ideally suited for markets and applications that require extremely small, lightweight and reliable interconnects, our Microminiature Connectors feature higher density contact configurations than traditional rectangular solutions—without sacrificing quality or performance.
●Key Features
■Micro Twist Pin Contact System recessed into plug insulators
■Positions: 9, 15, 21, 25, 31, 37, 51, 69, 100
■Wire size: AWG 24 thru AWG 32
■Micro socket: Free standing used in receptacle side
■Current rating: 3A
■Durability: 500 mating cycles
■Contacts: Copper alloy; gold plated
■Low profile configurations available
■Designed to MIL-DTL-83513 specifications
■Operating temperatures:
▲MDM Standard: -55°C to +150°C
▲High Temp MDM (F222): -55°C to +200°C
▲Ultra-High Temp MDM (F300): -55°C to +230°C
Selection catalogue
- Cannon Brand & Portfolio Overview
- Microminiature Interconnect Solutions Overview
- Cannon Twist Pin Contact System
- Product Selection Guide
- Micro-D Metal Shell - .050” Contact Spacing (MDM)
- Micro-D Coaxial/Power - .050” Contact Spacing (MDM-C/P)
- Micro-D PCB - .050” Contact Spacing (MDM-PCB)
- 200ºC High-Temp Micro-D Wired Low Profile (MDLM F222)
- 200ºC High Temp Micro-D Board Mount PCB Low Profile (MDLM F222)
- 200ºC High Temp Micro-D
- 200ºC High Temp Micro-D Wired and Solder Pot (MDM-F222)
- 230ºC Ultra-High Temp Micro-D Wired and Solder Pot (MDM-F300)
- Micro-D Metal Shell - .050” Contact Spacing (MIL-DTL-83513)
- Accessories - Shielded Metal Backshell
- Hermetic (MDMH)
- Filter (TMDM)
- Micro-D Plastic Shell - .050” Contact Spacing (MD/MDB/MDB-PCB, MDV)
- Micro Center Jackscrew (MJS)
- Microminiature Circular - .050” Contact Spacing (MIK, MIKM, MIKQ)
- Microstrips .050” Contact Spacing (MT)
- Microminiature Strip - .100/.050” Contact Spacing(MT)
- Micro Edgeboard - .050” Contact Spacing (MEB)
- Cable Assemblies
- Flex Circuit Cable Assembly
- Custom Back Shells
- Appendix
- Standard Wire Termination “L” Code Chart
- Standard Wire Termination “H” Code Chart
- Wire Color Code Chart
- Micro-D Accessories Dust Caps
- About ITT Cannon
- Product Safety Information
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