Tpcm™ 580SP Phase Change Material
Tpcm™580SP is an exceptionally high performance, screen printable or stencilable thermal interface material designed to meet the thermal reliability and price requirements of high-end thermal applications. It contains a solvent to assist in processing. After drying off the solvent, Tpcm 580SP will be dry to the touch. Tpcm 580SP begins to soften and flow at temperatures around 50°C. At which point, Tpcm 580SP will fill the microscopic irregularities of the components it contacts. The result is an interface with minimal contact thermal resistance. Tpcm 580SP softens; it does not fully change state, resulting in minimal migration (pump out) under thermal cycling from room temperature to chip device operating temperature.
FEATURES AND BENEFITS：
●Low thermal resistance
●Ease of use for high volume manufacturing
●High thixotropic index
●Dry to the touch for pre-apply applications
●High thermal reliability, minimal pump out
●Re-flow compatible
●Cost Effective
|
[ Microprocessors ][ Chipsets ][ Graphic Processing Chips ][ Custom ASICs ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
|
|
|
English Chinese Chinese and English Japanese |
|
|
2017/12/17 |
|
|
|
|
|
|
|
|
351 KB |
- +1 Like
- Add to Favorites
Recommend
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
