Memory for Data Centers SMART’s Memory Solutions Provide Critical Competitive Advantages
2023-11-10
●Memory expansion for in-memory database applications utilizing CXL® Technology
■Increases memory bandwidth and capacity
▲Large amounts of memory accessed through the CXL interface eliminate conventional server bottlenecks.
▲Eliminates stranded memory by dynamically configuring memory to those workloads that need it.
▲New E3.S Memory Module (XMM) and Add in Card (AIC) options utilizing CXL technology
●Zefr Memory for AI and In Memory Database Applications
■Significantly reduce downtime by using highly reliable memory modules
▲Comprehensive 5-part test process; temperature, speed, load, system, and time
▲Zefr testing emulates the most strenuous use cases
▲Proven long-term reliability
●High Density Memory - RDIMMs
■Deliver massive computing power for HPC, AI, grid and cloud workloads
▲Ideal for data centers requiring large amounts of server memory
▲Up to 256GB DDR4 RDIMMs
▲Up to 256GB DDR5 RDIMMs
●Delivering New Tiers of Performance by enabling CXL
■New interconnect technology for high-speed, low-latency cache coherent access to data via serial-attached memory modules (XMMs, AICs)
▲Enables new solution architectures and form factors for delivering higher levels of performance (high-bandwidth, low latency)
▲SMART is providing enablement support for OEMs interested in CXL
●SMTL - SMART Memory Test Lab
■Extensive memory qualification services, capabilities and experience
▲Minimize qualification costs and resources
▲Save engineering time and resources
▲Shorten product launch cycles
▲Use SMART engineering resources to help solve problems
▲Maintain an uninterrupted supply chain of qualified memory
■Increases memory bandwidth and capacity
▲Large amounts of memory accessed through the CXL interface eliminate conventional server bottlenecks.
▲Eliminates stranded memory by dynamically configuring memory to those workloads that need it.
▲New E3.S Memory Module (XMM) and Add in Card (AIC) options utilizing CXL technology
●Zefr Memory for AI and In Memory Database Applications
■Significantly reduce downtime by using highly reliable memory modules
▲Comprehensive 5-part test process; temperature, speed, load, system, and time
▲Zefr testing emulates the most strenuous use cases
▲Proven long-term reliability
●High Density Memory - RDIMMs
■Deliver massive computing power for HPC, AI, grid and cloud workloads
▲Ideal for data centers requiring large amounts of server memory
▲Up to 256GB DDR4 RDIMMs
▲Up to 256GB DDR5 RDIMMs
●Delivering New Tiers of Performance by enabling CXL
■New interconnect technology for high-speed, low-latency cache coherent access to data via serial-attached memory modules (XMMs, AICs)
▲Enables new solution architectures and form factors for delivering higher levels of performance (high-bandwidth, low latency)
▲SMART is providing enablement support for OEMs interested in CXL
●SMTL - SMART Memory Test Lab
■Extensive memory qualification services, capabilities and experience
▲Minimize qualification costs and resources
▲Save engineering time and resources
▲Shorten product launch cycles
▲Use SMART engineering resources to help solve problems
▲Maintain an uninterrupted supply chain of qualified memory
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