RX23W Bluetooth Module Smallest Bluetooth Module with System Control

PublishTime：2023-09-22

●Based on RX23W Bluetooth 5.0 Microcontroller with added build-in antennas, oscillators, and matching circuitry for IoT endpoint device.
● Smallest Module within its class and capable of using as a system control with wireless communication
● Certified Radio Law for US/EU/Japan/Canada and Bluetooth SIG
●Features
■Certified under the Radio Law in Japan/Europe (CE), the US(FCC) and Canada (ISED)
■ Smallest package (6.1 x 9.5 mm 83-pin LGA), in its class with a system control MCU.
■ High-performance RXv2 cores (54MHz) and DSP with extremely high-power efficiency
■ Supports all Bluetooth 5.0 features, including 2Mbps, long range, and meshed networking
■ Built-in touch keys, USB, CAN, and other rich peripheral functions that are essential to IoT devices
■Robust security features through Trusted Secure IP (TSIP) Lite
●Benefits
■Shorter Time to Market with readily Certified Radio Law Module, help reduce development time for acquiring certification.
■ Small size (PKG) and reduction of the external components with abundant built-in peripheral functions reduce total BOM cost and suitable for IoT endpoint devices.
■ Easy and Quick development using BTTS(Bluetooth Test Tool Suite and GATT Browser
■ Free-of-charge Bluetooth® Low Energy protocol stacks and Mesh stacks

Brand of Product：	Renesas
Part#：	RX23W 、 R5F523W More Part#
Product Category：	Bluetooth Module 、 Smallest Bluetooth Module 、 Bluetooth 5.0 Microcontroller More
Application：	[ Healthcare ][ BGM ][ BPM ][ Medical monitor ][ Activity monitor ][ Smart home ][ Building ][ Appliances ][ Security ][ Lighting ][ Air-con ][ Industrial Equipment ][ Office Equipment ][ Printer ][ Fleet Management ][ Logistic Management ][ Agriculture ][ Wearable Devices ][ Tracking ][ Fitness ][ IoT Connected Application ] More
Data Type：	Supplier and Product Introduction More
Safety & Environment Standards：	More
Operating Temperature：	Please see the document for details
Qualification Grade：	More
Qualification Approval：	More
Package：	LGA;QFN;BGA
Language：	English Chinese Chinese and English Japanese
Date of Creation：	2023/8/7
Version Number：
Data Encoding：	IPM2-AA-23-0125-1
Data Size：	519 KB

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