FSC-BW110 Wi-Fi Single-band 1X1 + Bluetooth 2.1+ EDR/Bluetooth 3.0/3.0 + HS/4.2 Combo Module Datasheet
■FSC-BW110 is a small size and low profile of Wi-Fi + BT Combo module with LGA(Land-Grid Array) footprint, board size is 12mm*12mm with module thickness of 1.9mm. It can be easily manufactured on SMT process and highly suitable for tablet PC, ultra book, mobile device and consumer products. It provides SDIO interface for Wi-Fi to connect with host processor and high speed UART interface for BT. It also has a PCM interface for audio data transmission with direct link to external audio codec via BT controller. The Wi-Fi throughput can go up to 150Mbps in theory by using 1x1 802.11n b/g/n MIMO technology and Bluetooth can support BT2.1+EDR/BT3.0 and BT4.2. FSC-BW110 uses highly integrated Wi-Fi/BT single chip based on advanced COMS process. FSC-BW110 integrates whole Wi-Fi/BT function blocks into a chip, such as SDIO/UART, MAC, BB, AFE, RFE, PA, EEPROM and LDO/SWR, except fewer passive components remained on PCB.
■This compact module is a total solution for a combination of Wi-Fi + BT technologies. The module is specifically developed for Smart phones and Portable devices.
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Wi-Fi Single-band 1X1 + Bluetooth 2.1+ EDR/Bluetooth 3.0/3.0 + HS/4.2 Combo Module 、 small size and low profile of Wi-Fi + BT Combo module 、 compact module |
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[ Smart phones ][ Portable devices ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/04/27 |
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Version 1.1 |
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4.1 MB |
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