Thermal Grease 21-430SF

2023-07-07
●JONES Thermal Grease 21-430SF is a silicone-free based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
●FEATURES & BENEFITS
■Thermal Conductivity: 3 W/m·K
■Moderate Viscosity
■Low Thermal Resistance
■High Thermal Conductivity
■Silicon-free
■Solvent-free

JONES

21-4XXSF-YYY21-430SF

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Part#

Thermal Greasesilicone-free based, high performance thermal interface materialThermal management material

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CPUs ]Notebooks ]PCs ]Servers ]LED Solid State Lighting ]GPUs ]ASIC ]Northbridge chipsets ]heat sink ]

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Datasheet

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Please see the document for details

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English Chinese Chinese and English Japanese

2022 Feb.

Version 2022 Feb.

TDS.21-430SF V.C.0

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