Thermal Grease 21-430H
●FEATURES & BENEFITS
■Thermal Conductivity :3.3W/m·K
■Moderate Viscosity For Easy Application
■No post “Cure” required
■High Thermal Conductivity
■No Dry Out @150°C
■Solvent-free
21-430H 、 21-4XXH-YYY 、 21-430H-055M 、 21-430H-1000 、 21-430H-2000 |
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Thermal Grease 、 silicone based, high performance thermal interface material 、 Thermal management material |
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[ CPUs ][ GPUs ][ ASIC ][ Northbridge chipsets ][ heat ][ Notebooks ][ PCs ][ Servers ][ LED Solid State Lighting ][ ASICS Chips ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022 Jun. |
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Version 2022 Jun. |
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TDS.21-430H.V.C.0 |
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798 KB |
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