Thermal Grease 21-430H

2023-07-06
●JONES Thermal Grease 21-430H is a silicone based, high performance thermal interface material. It is designed to perform high thermal conductivity between high watt density chips like CPUs, GPUs, ASIC, Northbridge chipsets and heat sink. It demonstrates outstanding thermal performance and high reliability while wetting out the thermal interfaces under assembly pressure.
●FEATURES & BENEFITS
■Thermal Conductivity :3.3W/m·K
■Moderate Viscosity For Easy Application
■No post “Cure” required
■High Thermal Conductivity
■No Dry Out @150°C
■Solvent-free

JONES

21-430H21-4XXH-YYY21-430H-055M21-430H-100021-430H-2000

More

Part#

Thermal Greasesilicone based, high performance thermal interface materialThermal management material

More

CPUs ]GPUs ]ASIC ]Northbridge chipsets ]heat ]Notebooks ]PCs ]Servers ]LED Solid State Lighting ]ASICS Chips ]

More

Datasheet

More

More

Please see the document for details

More

More

English Chinese Chinese and English Japanese

2022 Jun.

Version 2022 Jun.

TDS.21-430H.V.C.0

798 KB

- The full preview is over,the data is 2 pages -
  • +1 Like
  • Add to Favorites

Recommend

All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.

Contact Us

Email: