CH101 and CH201 Ultrasonic Transceiver Handling and Assembly Guidelines
■This document provides information and general guidelines for handling and assembling boards with CH101 and CH201 ultrasonic transceivers. The goal of the processes outlined herein is to prevent damage of ultrasonic transceivers due to mechanical, vacuum and thermal stress caused by the handling process. Any deviation from the recommendations contained in this Application Note should be reviewed by Chirp Microsystems and thoroughly verified prior to implementation in a production environment.
■The CH101 and CH201 ultrasonic transceivers are compatible with existing industrial Surface Mount Technology (SMT) processes. An important feature of the ultrasound transceiver is the open acoustic port hole on the top of the package. This exposes the internal MEMS ultrasonic transducer to the external environment. Care must be taken to ensure that no particulates enter this port hole, and there is no damage to the internal MEMS membrane contained in the device.
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User's Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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11/24/2019 |
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Revision: 1.0 |
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AN-000159 |
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909 KB |
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