Fine Ceramics for Electronics
2023-06-13
●INDEX
◆Ceramic Substrates
■Material Characteristics of Ceramic Substrates
■Thick Film Printing Substrates
■Alumina Metallized Substrates
■Long Thick Film Printing Substrates
■Thin Film Printing Substrates
■Polished Thin Film Printing Substrates
■Single Crystal Sapphire Substrates
■High Reflectivity Alumina Substrates
■Laser Cutting Design Guideline (Reference)
■Glazing (Optional)
◆Heat Dissipation Substrates
■Heat Dissipation Structure Ceramic Substrates
◆Functional Materials
■Inductor Cores
■Piezoelectric PZT Substrates
◆Device Peripherals
■Sapphire Cover Plates
■Volume Production Components for Various Electronics
■Ultra Thin Ceramic Caps
■High Voltage-resistant Alumina Ceramic
◆Ceramic Substrates
■Material Characteristics of Ceramic Substrates
■Thick Film Printing Substrates
■Alumina Metallized Substrates
■Long Thick Film Printing Substrates
■Thin Film Printing Substrates
■Polished Thin Film Printing Substrates
■Single Crystal Sapphire Substrates
■High Reflectivity Alumina Substrates
■Laser Cutting Design Guideline (Reference)
■Glazing (Optional)
◆Heat Dissipation Substrates
■Heat Dissipation Structure Ceramic Substrates
◆Functional Materials
■Inductor Cores
■Piezoelectric PZT Substrates
◆Device Peripherals
■Sapphire Cover Plates
■Volume Production Components for Various Electronics
■Ultra Thin Ceramic Caps
■High Voltage-resistant Alumina Ceramic
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