ICS‐43432 Low‐Noise Microphone with I2S Digital Output
■The ICS‐43432 is a digital I2S output bottom port microphone. The complete ICS‐43432 solution consists of a MEMS sensor, signal conditioning, an analog‐to‐digital converter, decimation and anti‐aliasing filters, power management, and an industry standard 24‐bit I²S interface. The I²S interface allows the ICS‐43432 to connect directly to digital processors, such as DSPs and microcontrollers, without the need for an audio codec in the system.
■The ICS‐43432 has a high SNR of 65 dBA and a wideband frequency response. The sensitivity tolerance of the ICS‐43432 is ±1 dB, which enables high‐performance microphone arrays without the need for system calibration.
■The ICS‐43432 is available in a small 4 mm × 3 mm × 1 mm surface‐mount package.
●FEATURES
■Digital I²S Interface with High Precision 24‐bit Data
■High 65 dBA SNR
■−26 dB FS Sensitivity
■±1 dB Sensitivity Tolerance
■Wide Frequency Response from 50 Hz to 20 kHz
■Low Current Consumption: 1.0 mA
■High Power Supply Rejection: −80 dB FS
■116 dB SPL Acoustic Overload Point
■Small 4 mm × 3 mm × 1 mm Surface‐Mount Package
■Compatible with Sn/Pb and Pb‐Free Solder Processes
■RoHS/WEEE Compliant
|
Low‐Noise Microphone with I2S Digital Output 、 digital I2S output bottom port microphone |
|
|
[ Wearables ][ Smart Televisions ][ Remote Controls ][ Teleconferencing Systems ][ Gaming Consoles ][ Security Systems ][ Microphone Arrays ] |
|
|
Datasheet |
|
|
|
|
Please see the document for details |
|
|
|
|
|
|
|
|
LGA_CAV |
|
|
English Chinese Chinese and English Japanese |
|
|
4/27/2016 |
|
|
Revision: 1.3 |
|
|
DS‐000038 |
|
|
1.5 MB |
- +1 Like
- Add to Favorites
Recommend
- InvenSense Announces World’s Smallest, Lowest Power I²S Microphone ICS-43434 for IoT and Wearable Markets
- InvenSense® Introduces Comprehensive Portfolio of Disruptive New Digital and Analog Microphones
- TDK Announces the InvenSense ICP-10125 Waterproof SmartPressure™ Sensor Platform, Achieving the Industry’s Lowest Pressure Noise of 0.4 Pa RMS
- InvenSense® Provides High-Accuracy Turn-By-Turn Navigation User Experience To HiSilicon Mobile Platforms and Huawei Smartphones
- TDK’s New SmartMotion® Platform Accelerates Development of IOT Solutions Based on Invensense Motion Sensors
- InvenSense® Announces UltraPrint™ Mass-Manufacturable Ultrasound Fingerprint Touch Sensor Solution
- InvenSense® Ushers in the Era of Sensor System-On-Chip With the World’s First Integrated Motion Sensor and Multi-Core Processing
- InvenSense® Announces Contextual Awareness SDK for Embedded Developers and Mobile Devices
All reproduced articles on this site are for the purpose of conveying more information and clearly indicate the source. If media or individuals who do not want to be reproduced can contact us, which will be deleted.
Integrated Circuits
Discrete Components
Connectors & Structural Components
Assembly UnitModules & Accessories
Power Supplies & Power Modules
Electronic Materials
Instrumentation & Test Kit
Electrical Tools & Materials
Mechatronics
Processing & Customization
