Thick Film Chip Dividers, High Voltage CDHV Vishay Techno
●FEATURES
■High voltage up to 3000 V
■ Typical resistance ratios of 250:1, 500:1, etc.;maximum resistance ratio of 800:1
■ Flow solderable
■ Tape and reel packaging available
■ Termination style: 3-sided wraparound termination or single termination flip chip available
■Suitable for solderable, epoxy bondable, or wire bondable applications
■ Termination material: solder-coated nickel barrier or solder coated non-magnetic terminations standard; gold, palladium silver, platinum gold, platinum silver or platinum palladium gold terminations available
■Multiple styles, termination materials and configurations, allow wide design flexibility
■Epoxy bondable or wire bondable non-magnetic terminations available
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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21-Jul-16 |
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Revision: 21-Jul-16 |
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68020 |
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181 KB |
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