RA2E1 Group RA2E1 HS3001 Sensor Device Sample
■This document describes a Renesas microcontroller RA2E1 application for an HS3001 sensor device using the RA2E1 Fast Prototyping Board.
●Abstract:
■The HS3001 sensor device sample is a precision digital sensor featuring indoor temperature, humidity using the RA2E1 Fast Prototyping Board. With an OLED screen, it makes all the information well displayed and shows different levels of temperature and humidity in different colors, with each color corresponding to a different level of physical concern. The backlight makes it possible to view the screen and every detail from every angle, even in the dark night.
■The RA2E1 Fast Prototyping Board comes equipped with a high-performance RA2E1 microcontroller and is an evaluation board specialized for prototype development for a variety of applications. It has a built-in emulator circuit that is equivalent to an E2 emulator Lite so you can write/debug programs without additional tools. In addition, with Arduino Uno and Pmod™ interfaces included standard and through-hole access to all pins of the microcontroller, and so on, it has high expandability.
■The HS3001 is a highly-accurate, fully-calibrated relative humidity and temperature sensor. The high accuracy, fast measurement response time, and long-term stability, along with the small package size, makes the HS3001 ideal for a wide number of applications from portable to harsh environments. An integrated calibration and temperature compensation logic provides fully corrected RH and T values via a standard I²C output. The measured data is internally corrected and compensated for accurate operation over a wide range of temperature and humidity levels–user calibration is not required.
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RA2E1 Group 、 RA2E1 、 R7FA2E1A92DFM 、 FPB-RA2E1 、 US082-HS3001EVZ 、 HS3001 、 RTK7FPA2E1S00001BE |
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Sensor Device 、 microcontroller 、 sensor 、 precision digital sensor 、 highly-accurate, fully-calibrated relative humidity and temperature sensor 、 MCU 、 Board 、 FPB Board 、 Fast Prototyping Board 、 FPB |
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Application note & Design Guide |
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Please see the document for details |
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LQFP;BGA;HWQFN;WLCSP |
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English Chinese Chinese and English Japanese |
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Nov 10, 2021 |
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Rev.1.00 |
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R01AN6016EC0100 |
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2.2 MB |
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