Data Sheet Specification Change for Intersil Product ISL59534IKEZ (PA11105)
●Subject: Data Sheet Specification Change for Intersil Product ISL59534IKEZ
●This advisory is to inform you that Intersil has updated the data sheet specification for the listed ISL59534IKEZ product. The change to θJA for the HBGA (Heatsink Ball Grid Array) package in the Thermal Information section aligns the data sheet with the product characteristics.
●Data sheet specification changes for θJA are as follows:
■Thermal Resistance: 356p HBGA
■Current Value: 4.7 – 18* °C/W
■New Value: 24°C/W
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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October 11, 2011 |
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PA11105 |
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132 KB |
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October 11, 2011 |
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Data Sheet Specification Change |
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