Board Level Cooling
■Boyd has the expertise to design and manufacture cooling solutions spanning the entire range of thermal efficiency and mechanical complexity.
■Experts at solving cooling challenges ranging from networking, telecom and consumer electronics, to power and biomedical devices. Utilizing the latest CFD/ FEA and experimental techniques Boyd can:
●Perform conjugate analyses with conduction, convection and radiation
●Optimize venting and fan placement
●Increase power density
●Reduce noise, cost and size.
●Increase MTBF
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