MTE21Y0500 HERMOELECTRIC COOLER DATASHEET
■Ceramics of both sides: Ceramic (AlN>170W.m/K)
■Internal assembly: Solder Sn-Sb(230ºC)
■Terminal connection: Pads for wire bonding
■Hot side surface metallization: Available
■Cold side surface metallization: Available
■Cooler polarity: Standard (left “-” and right “+”)
■High-Density pellets placement technology
■Bi-Te material: high-grade, hot-extruded type
■RoHS Compliant design
■Reliability meet TELCORDIA GR-468 CORE and MIL-STD-883 requirement.
■MAX process temperature: 220℃ short time.
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2023-04-19 |
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Rev00 |
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542 KB |
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