晶导微电子5.0SMDJ Series
●FEATURES
■For surface mounted applications in order to optimize board space
■Low profile package
■Built-in strain relief
■Glass passivated junction
■Low inductance
■Excellent clamping capability
■Fast response time: typically less than1.0 ps from 0 volts to BV for unidirectional types
■Typical IR less than 1μA above 10V
■High temperature soldering:250°C/10 seconds at terminals
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