Titanium Ultra-Thin Vapor Chambers
■Titanium Vapor Chambers utilize passive two-phase heat transfer to conduct heat between 10 to 40 times more than solid copper. Two-phase heat transfer helps move and spread heat without the use of any active components like fans or pumps, making them extremely reliable thermal management solutions.
■The high yield strength of titanium enables thinner and lighter vapor chamber construction compared to copper. Thinner vapor chamber walls maximize the internal vapor space that drives the high effective thermal conductivity of two phase components regardless of thermal conductivity of the metal itself. Switching to Titanium Vapor Chambers can help you decrease the thickness of your thermal management solution or maximize the power transferred from your heat source.
■With increased strength over traditional copper components, Titanium Vapor Chambers enable product designers to combine mechanical and structural functions into this single thermal management solution. Boyd’s ability to highly customize wick structures optimize vapor chamber performance with a stronger material. Over the past 5 years, Boyd has developed robust and repeatable high volume manufacturing methods that leverage the attractive qualities of Titanium within a cost-effective processes.
■Leverage the reliable thermal and mechanical benefits of Titanium Ultra-Thin Vapor Chambers in applications where space and weight are at a premium, such as mobile and consumer electronic products as well as eMobility applications.
●Features and Benefits
■Enables innovation by allowing higher power and faster chipset speeds at reduced weight and within a smaller volume
■Improved design flexibility with mounting holes, bends and easy integration with other functions
■Increased reliability with cooler touch temperatures and electronic operating temperatures. Passes long term operation, thermal cycling, and freeze-thaw testing
■Reduces total cost of ownership with integrated thermal management, EMI Shielding, and mechanical/structural support.
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[ mobile ][ consumer electronic products ][ eMobility applications ] |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2021/11/18 |
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761 KB |
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