CBRDFSH1-100 Schottky bridge rectifier Product / Process Change Notice (246)
■The CBRDFSH1-100 Schottky bridge rectifier manufactured in the BR DFN case.
●Extent of change:
■Change in wafer fab, resulting in change in die size from 32 x 32 mils to 35 x 35 mils
●Reason for change:
■As part of Central Semiconductor’s supply chain risk mitigation initiative, and in an effort to ensure an undisrupted supply of product, a change in wafer fabrication site is being made for the products referenced above. Product specifications, quality and reliability are not impacted by this change.
●Effect of change:
■This change does not affect the fit, form or function of the devices.
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PCN/EOL |
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Please see the document for details |
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DFN |
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English Chinese Chinese and English Japanese |
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March 14, 2023 |
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R2 |
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246 |
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258 KB |
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