Applications of E-CAPs
■The E-CAP family of silicon capacitors is a new technology developed and marketed by Empower Semiconductor that offer breakthroughs in density and performance. This technology offers both discrete and integration capabilities for broad market and custom, monolithic solid-state device in the world’s thinnest, most compact, and most flexible capacitor solution. Designed using the advanced deep trench capacitor technology, the latest E-CAP solutions offer densities of 1.1 μF/mm 2(with a path to 1.5 μF/mm 2) which is over twice the density of alternative silicon capacitor technologies. Figure 1 shows an illustration of the space saving that can be achieved with E-CAP solutions. By integrating an array of capacitors into a single die, this technology allows for better component placement, flexible pin-out and the use of different value capacitors to save a significant amount of area and reduce the number of discrete components. In addition to the density, thinness levels can be achieved below 50 μm in overall height. E-CAP density is over five times that of leading multilayer ceramic capacitors (MLCCs) with improved equivalent series inductance (ESL in the pH range) and equivalent series resistance (ESR in the 10 of mΩ range) characteristics that improves power supply bypassing and PDN optimization over a broad frequency range.
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silicon capacitors 、 multilayer ceramic capacitors 、 MLCCs 、 deep trench capacitor 、 Bypass capacitors |
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Application note & Design Guide |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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August 2022 |
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AN-ECxx-1 |
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1.7 MB |
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