MCU/SOC products announcement of Full Carton Product Change Notice (PCN) (SAG-B-22-0002)
2023-02-21
●Subject: MCU/SOC products announcement of Full Carton
●Revision Description: Initial release
●Description of Change: Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.
●Reason for Change: To secure a stable product supply and environment friendly strengthening. (Improvement of efficiency in use of packaging resources, reduction of waste)
●Impact on Fit, Form, Function, Quality & Reliability: No impact.
●Product Identification:
■Packing Form: Change to Full Carton (full packing) from fraction packing.
■Booking Part Number: Change to new Booking Part Number.(Please see "Appendix A".)
●Revision Description: Initial release
●Description of Change: Renesas will change packing form with a tray to Full Carton (full packing) from fraction. Full Carton shipment will be standard and combine maximum 3 production lots at worst case. Booking Part Number and Order quantity will be changed.
●Reason for Change: To secure a stable product supply and environment friendly strengthening. (Improvement of efficiency in use of packaging resources, reduction of waste)
●Impact on Fit, Form, Function, Quality & Reliability: No impact.
●Product Identification:
■Packing Form: Change to Full Carton (full packing) from fraction packing.
■Booking Part Number: Change to new Booking Part Number.(Please see "Appendix A".)
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