KH-IPEX-K501-29 RF1 BOARD CONN ASSEMBLY DWG
■HOUSING MATERIAL: THERMOPLASTIC, white, UL 94V-0;
▲CONTACT MATERIAL: COPPER ALLOY;
▲GOLD PLATED: CONTACT AREA 2u" Min & SOLDER AREA 1u" Min;
▲SHELL MATERIAL: COPPER ALLOY;
▲GOLD PLATED: CONTACT AREA 0.0508um Min & SOLDER AREA 0.0254um Min;
■PERFORMANCE:
▲CONTACT RESISTANCE: 20mOHM Max.
▲DIELECTRIC WITHSTANDING VOLTAGE: 100V AC FOR 1 MINUTE;
▲INSULATION RESISTANCE: 500MOHM Min.
■COPLANARITY: 0.1mm Max.
■APPLIED TO IR SOLDERING PROCESS.
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2016.12.09 |
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REV: A |
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239 KB |
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