XKSD-1250-29 SD CARD CONN
■Material:
▲Plastic: LCP, S475, Black,HF, UL94V-0
▲Contact: C5210
▲Shell: SUS304
■Plating:
▲Contact:
◆Contact Area: Au 1 min. Plating. Over Ni 50μ" min.
◆Soldertail: Matte Tin 100μ" min. Plating. Over Ni 50μ" min.
▲Shell: Solderability Ni 50μ" min. Over All
■Contact And Tail Coplanarity To Be 0.10mm max.
■Electrical Characteristics:
▲Contact Current Rating: 0.5Amperes.
▲Dielectric Withstanding Voltage: AC500V r.m.s
▲Insulation Resistance: 1000 Megohms
▲Contact Resistance: 100 mΩ Maximum.
■Mechanical Characteristics:
▲Mating Cyeles: 10,000 Cycles.
■Environmental:
▲Operating Temperature: -25°C~+85°C.
▲Salty spray: 48H
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Product Drawing |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/7/20 |
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REV A0 |
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XKSD-1250-29 |
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1.3 MB |
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