Transmission Line MIM Capacitor (Metal-Insulator-Metal)
●Thin Film Technologies is pleased to introduce a novel MIM (Metal-Insulator-Metal) capacitor using a transmission line wire bond pad structure with backside ground.
●The TL MIM can be supplied on quartz, alumina, glass and other substrates to minimize losses. Copper traces are used for optimal conductivity. Front and backside gold metalization make this device suitable epoxy, gold wire bond/ribbon bond attachments
■FEATURES
●HFSS Design Unique for every device
●Gold Wirebondable
●Copper Conductor Design for improved Circuit Conductivity
●Designs Optimized for RF/Performance
●ROHS Compliant
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MV0402A150MQAW 、 MV0404CA1R0MQAW 、 MV0402CA5R0MQAW 、 MV0404CA5R0MQAW 、 MV0404CA150MQAW 、 MV0402CA150MAAW 、 MV0404CA150MABW 、 MV0304CA150MABW 、 MV0804CA150MABW 、 MV0402CA1R0MQAW |
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[ UHF ][ High Frequency Link ][ RF Microwave applications ] |
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Datasheet |
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Please see the document for details |
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English Chinese Chinese and English Japanese |
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2022/10/19 |
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Rev 1 |
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TDS-STFP-0003 |
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343 KB |
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